Photonect Interconnect Solutions

photonectcorp.com

Photonect, is a Rochester-based startup, addressing a critical bottleneck in photonics packaging: slow, costly, and unstable fiber-to-chip attachment. Our patented oxide mode converter and adhesive-free laser fusion process form permanent glass-to-glass bonds in under a minute, boosting efficiency from 50% to 80%, increasing throughput 10×, and reducing per-device costs by 50% while maintaining <1 dB coupling loss. These innovations enable high-performance photonic packaging at previously unattainable speed and affordability. Photonect is now advancing this technology into PIX-Attach, the first-of-its-kind, Rochester-designed laser splicing system for high-volume photonic integration.